PART |
Description |
Maker |
MX23L12810-1 MX23L12810RC-10 MX23L12810RC-12 MX23L |
CAP TANT LOWESR 33UF 25V 20% SMD 8M X 16 MASK PROM, 120 ns, PDSO48 NEW 128M-BIT (16M x 8 / 8M x 16) MASK ROM FOR TSOP PACKAGE
|
Macronix International Co., Ltd. PROM MCNIX[Macronix International]
|
23L1613-70 23L1613-90 |
16M-BIT MASK ROM
|
Macronix International Co., Ltd.
|
MX23L1614XI-90 MX23L1614 MX23L1614-10 MX23L1614-70 |
16M-BIT MASK ROM
|
MCNIX[Macronix International]
|
MX23L1612XI-90G 23L1612-70 23L1612-90 MX23L1612 MX |
16M-BIT MASK ROM
|
MCNIX[Macronix International]
|
23L1612-90 |
16M-BIT MASK ROM 1,600位掩膜ROM
|
Macronix International Co., Ltd.
|
MX23L6410AMC-90G |
64M-BIT PAGE MODE MASK ROM 4M X 16 MASK PROM, 90 ns, PDSO44
|
Macronix International Co., Ltd.
|
K3N5C1000D-DGTC |
16M-Bit (2M x 8/1M x 16) CMOS MASK ROM Data Sheet
|
Samsung Electronic
|
K3N5VU1000F-DGCTC |
16M-Bit (2Mx8 /1Mx16) CMOS MASK ROM Data Sheet
|
Samsung Electronic
|
MX23L12811-1 MX23L12811RC-10 MX23L12811RC-12 MX23L |
NEW 128M-BIT (16M x 8 / 8M x 16) MASK ROM WITH PAGE MODE(TSOP PACKAGE)
|
PROM MCNIX[Macronix International]
|
KM23V16005DG |
16M-Bit (2Mx8 /1Mx16) CMOS Mask ROM(16M2M×8/1M×16) CMOS掩膜ROM)
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
UPD703100AGJ-33-UEN UPD703100GJ-33-UEN UPD703101AG |
ROM-less version; Internal RAM: 4K bytes Mask ROM version; Mask ROM: 96K bytes; Internal RAM: 4K bytes Mask ROM version; Mask ROM: 128K bytes; Internal RAM: 4K bytes Flash version; Internal flash: 128K bytes; Internal RAM: 4K bytes 32-bit RISC microcontroller (V850E/MS2:ROMless,Internal RAM: 4 KB)
|
NEC
|